We have constantly argued that STATS’s outlook has brightened as the demand for advanced level packaging such as the wafer level packaging are coming through faster than what the market is anticipating thanks to the booming of the wireless gadget.  (Edison Chen/OSK DMG)Stats ChipPAC (STATS), the world’s 4th largest Outsourced Semiconductor Assembly and Test (OSAT) player, celebrated the grand opening of its new building in Singapore along with an ambitious plan to invest USD500m locally in the next three years. In line with our previous channel checks, STATS’s advanced level packaging product has been gaining traction, especially for its Wafer Level Ball Grid Array (eWLB) packaging technology, growing rapidly in contributing to the group’s financial performance.