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Pls share - Stats Chip Pac
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Octavia
Elite |
31-Jan-2013 17:58
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The news release announcing the fourth quarter and full year 2012 results will be disseminated on 31 January 2013 after the Singapore Exchange Securities Trading Limited (“SGX-ST”) market closes. A conference call with analysts and investors on Friday, 1 February 2013 at 8:00 a.m. in Singapore to discuss the Company’s results for the fourth quarter and full year 2012 and business outlook for the first quarter 2013. Hope for the best!! |
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terencee
Master |
31-Jan-2013 17:44
Yells: "I don't entertain trolls." |
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I wonder if they will decide to give dividends or not. If they do, I would expect their shares at least hit 0.65 
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Listing
Senior |
31-Jan-2013 17:25
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Tmr will be 60c don't miss this run! | ||||
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Octavia
Elite |
31-Jan-2013 16:17
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I think they are trying to close it at 55 today. Huat arh. 
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terencee
Master |
31-Jan-2013 15:14
Yells: "I don't entertain trolls." |
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Haha.. Tonight release of annual financial results. Already got estimate that the current quarter earnings is 18% more than previous. This is only a conservative figure.
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Octavia
Elite |
31-Jan-2013 13:28
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Wow,this counter still have pent up interest.Something is brewing....
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Octavia
Elite |
30-Jan-2013 20:24
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Those who bought at 30c and holding in big volume gonna " tau huat" arh.Can smell 60c already.
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terencee
Master |
30-Jan-2013 17:12
Yells: "I don't entertain trolls." |
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31 Jan 2013 STATSChP Full Year Results On 4 January 2013, the Company updated its outlook for the Company’s fourth quarter 2012, when the Company expected net revenues to be approximately $475 million to $482 million, an increase of approximately 16% to 18% compared to the prior quarter, with adjusted EBITDA in the range of 25% to 26% of revenue, and capital expenditure of approximately $55 million to $60 million in the fourth quarter of 2012. |
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terencee
Master |
30-Jan-2013 11:14
Yells: "I don't entertain trolls." |
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The up trend seemed rather strong. Hope Friday everyone see results and buy in. Currently lack volume and too many selling.
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Listing
Senior |
30-Jan-2013 09:07
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This one will go beyond $1...
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Listing
Senior |
30-Jan-2013 09:05
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Octavia
Elite |
29-Jan-2013 23:20
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Brudder, thanks for sharing the TA.Gotta to accumlate more during dips. The company will be releasing their 4Q/full yr 2012 result this coming friday.Hope it will be a positive one and might come with a dividend announcement.
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Bintang
Elite |
29-Jan-2013 23:00
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After breaking the neckline at $0.47 with big volume yesterday ( 28/1/2013 ) , it pulled back for a correction today . RSI is fine at 74 , directional movement index are positive , n Chaikin oscillator is rising from negative into positive area . If taking the distance from the head to the neckline of the H& S pattern , the target price would be 64 cents , n there was a gap at 63 cents which created on 04/08/2011 not filled yet .
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Octavia
Elite |
29-Jan-2013 21:52
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In the heyday,this stock used to be $10plus.Hope it can reach $1+. | ||||
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terencee
Master |
29-Jan-2013 18:43
Yells: "I don't entertain trolls." |
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Hsinchu, Taiwan, January 29, 2013 –STATS ChipPAC Ltd. (SGX-ST: STATSChP), a leading semiconductor advanced packaging and test service provider, and United Microelectronics Corporation (NYSE: UMC TWSE: 2303) (" UMC" ), a leading global semiconductor foundry, today announced the world’s first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, successfully reached a major milestone on package-level reliability assessment. This success demonstrates a total solution for reliable 3D IC manufacturing through the combination of UMC’s foundry and STATS ChipPAC’s packaging services. ”The next level of chip integration is rapidly evolving, and 3D IC technology is poised to enable the next frontier of IC capabilities for customers under various deployment models.” said Shim Il Kwon, VP of Technology Innovation of STATS ChipPAC, “The open ecosystem collaborative approach drives proven and reliable 3D IC solutions for the semiconductor market by combining the foundry partner’s robust, leading-edge TSV and front-end-of-line (FEOL) process technologies in a complementary platform with an Outsourced Semiconductor Assembly and Test (OSAT) service provider with innovative engineering excellence to seamlessly integrate mid-end-of-line (MEOL) and back-end-of-line (BEOL) 3D IC processes. We are pleased with UMC’s commitment to this role and look forward to future collaborations. The results are a proven solution platform that will enable customers to capitalize on new market opportunities.”S.C. Chien, vice president of Advanced Technology Development at UMC, said, “We see no imperative to restrict 3D IC to a captive business model, as UMC’s development work with nearly all the major OSAT partners for 3D IC has been very productive. Our successful collaboration with a leading OSAT partner like STATS ChipPAC has further established the viability of an open ecosystem approach. This model should work especially well for our mutual 3D IC customers, as foundry and OSAT can utilize their respective core strengths during development and delivery, while customers can benefit from keeping supply chain management flexible and realize better transparency over technology access compared to closed, captive 3D IC business models.” UMC and STATS ChipPAC’s proven open ecosystem 3D IC approach sets an important standard for collaboration within the industry supply chain to achieve mutual success. Under the 3DIC open development project with STATS ChipPAC, UMC provides the FEOL wafer manufacturing, with a foundry grade fine pitch, high density TSV process that can be seamlessly integrated with UMC’s 28nm poly SiON process flow. The know-how developed will be applied towards implementation on the foundry’s 28nm High-K/metal gate process. For MEOL and BEOL, STATS ChipPAC performs the wafer thinning, wafer backside integration, fine pitch copper pillar bump and precision chip-to-chip 3D stacking. http://info.sgx.com/webcoranncatth.nsf/VwAttachments/Att_159E36D65E134F8648257B0200385997/$file/CorpRel_29Jan13.pdf?openelement |
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terencee
Master |
29-Jan-2013 09:34
Yells: "I don't entertain trolls." |
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gap up on opening. but drop again. | ||||
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Octavia
Elite |
29-Jan-2013 09:32
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Spreadtrum Adopts STATS ChipPAC’s Innovative Packaging for China’s Smartphone Market Spreadtrum Communications, a leading fabless semiconductor provider in China, has adopted STATS ChipPAC’s packaging innovations for a number of its mobile chipsets. The combination of Spreadtrum’s advanced silicon design capabilities with STATS ChipPAC’s next generation embedded Wafer Level Ball Grid Array (eWLB) packaging technology offers increased performance and compact form factor at a competitive cost for the fast-growing China smartphone market. Read more:http://info.sgx.com/webcoranncatth.nsf/VwAttachments/Att_F609EBC47672D85C48257AFC0034B10C/$file/CorpRel_23Jan13.pdf?openelement |
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terencee
Master |
29-Jan-2013 08:55
Yells: "I don't entertain trolls." |
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x 0
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http://info.sgx.com/webcoranncatth.nsf/VwAttachments/Att_D5E857294527DFEB48257B010083A4A6/$file/CorpRel_29Jan13.pdf?openelement Singapore – 29 January 2013 – STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, announced today that it has signed a definitive Patent License and Settlement Agreement with Tessera, Inc. (the “Agreement”). This Agreement results in the dismissal of all claims and counterclaims between Tessera, Inc. and STATS ChipPAC and its subsidiaries STATS ChipPAC, Inc. and STATS ChipPAC (BVI) Limited and ends the patent litigation between the companies. In October 2012, the United States District Court for the Northern District of California granted the parties’ stipulated dismissal of the breach of license claims and counterclaims, so that this Agreement ends all outstanding litigation between the parties. The Agreement also provides STATS ChipPAC and its subsidiaries with a 5- year license to Tessera Inc.’s complete patent portfolio for semiconductor packaging technology. On 4 January 2013, the Company updated its outlook for the Company’s fourth quarter 2012, when the Company expected net revenues to be approximately $475 million to $482 million, an increase of approximately 16% to 18% compared to the prior quarter, with adjusted EBITDA 1 in the range of 25% to 26% of revenue, and capital expenditure 2 of approximately $55 million to $60 million in the fourth quarter of 2012. STATS ChipPAC now expects net revenues for the fourth quarter 2012 to be approximately $480 million, an increase of approximately 18% compared to the prior quarter due to strong demand in advanced packaging and test services for high end smartphones and tablets. As a result of the Agreement, STATS ChipPAC expects adjusted EBITDA 1 to be approximately 21% of revenue. Capital expenditure 2 is expected to be approximately $55 million in the fourth quarter of 2012. Excluding the Agreement, adjusted EBITDA would have been within our previous outlook guidance issued on 4 January 2013. The information and estimates provided in this update is subject to a number of risks and uncertainties that could cause final reported figures to differ materially from those disclosed in the fourth quarter 2012 update statements. These statements are based on our management’s beliefs and assumptions, which involve judgments about trends, events and conditions, all of which are subject to change and many of which are beyond our control. Please refer to our Financial Statements for the three and nine months ended 23 September 2012 filed with the Singapore Exchange Securities Trading Limited (“SGX-ST”) for the major assumptions made in preparing our outlook, including the update above, for the fourth quarter 2012. Investors should consider these assumptions and make their own assessment of the future performance of STATS ChipPAC and note that there may not be a direct correlation between the net income of the Company with adjusted EBITDA as a percentage of revenue. |
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Octavia
Elite |
28-Jan-2013 13:57
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Let the price come to you.Dont chase. | ||||
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Octavia
Elite |
28-Jan-2013 12:31
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This counter runs up so high before the result is out.I think price seems to have moved ahead of the good news and upon the result release trader likely to sell down and pick up from there again.
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